Copper-fill PLA

Intermediate

Copper Powder-Infused Polylactic Acid

A PLA composite loaded with fine copper powder that gives prints real metallic weight and the ability to develop a genuine patina over time. Copper-fill PLA is significantly heavier than standard PLA and can be polished, brushed, or chemically aged to achieve a true copper finish indistinguishable from cast metal at a glance.

حرارة الفوهة195220°C
حرارة المنصة50–60°C
سرعة الطباعة2040 mm/s

نصائح الطباعة

  • Use a hardened steel nozzle with a 0.5 mm+ bore — copper particles clog 0.4 mm brass nozzles quickly.
  • Print slowly (20-40 mm/s) to avoid under-extrusion; the heavy copper powder increases backpressure in the hotend.
  • Sand with 400-800 grit paper and buff with a cotton cloth to reveal the metallic copper surface beneath the PLA matrix.
  • Apply liver of sulfur solution to create an authentic green verdigris patina on finished prints.
  • Increase flow rate by 5-10% to compensate for the higher-density material; standard flow often leaves gaps.
  • Store sealed with desiccant — moisture causes the copper particles to oxidize inside the filament, weakening layer bonds.

حالات الاستخدام

Decorative sculptures and bustsJewelry prototypes with real metal feelSteampunk props and accessoriesAged copper hardware replicasAward trophies and plaquesArchitectural detail modelsFilm and theater props

الطابعات المتوافقة

Find Copper-fill PLA slicer settings for your printer — browse all printers and select Copper-fill PLA from the filament selector.

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