Copper-fill PLA Settings for Markforged FX20

Recommended slicer settings for printing Copper-fill PLA on the Markforged FX20 (525 x 400 x 400 mm build volume, 250 mm/s max speed, direct drive extruder).

Not Compatibleintermediate

Not Compatible

The max bed temperature of 0°C is below the recommended 50°C for Copper-fill PLA. Adhesion may be poor without additional bed adhesion aids.

Filament Nozzle Requirement195-220°C
Printer Max Nozzle385°C
Filament Bed Requirement50-60°C
Printer Max BedN/A

What to do instead

  • Your printer's bed maxes out at 0°C, but Copper-fill PLA needs at least 50°C for reliable adhesion.
  • Try a compatible filament for your Markforged FX20 — PLA, PETG, and ABS are good options.
  • If you need Copper-fill PLA specifically, you'll need a printer with a hotend capable of 195°C+ nozzle.

Copper-fill PLA Requirements

Copper-fill PLA Properties

Nozzle Range195-220°C
Bed Range50-60°C
Speed Range20-40 mm/s
Difficultyintermediate
EnclosureNot needed
DryingNot required

Markforged FX20 Specs

Build Volume525 x 400 x 400 mm
Max Speed250 mm/s
Max Nozzle Temp385°C
Max Bed TempN/A
ExtruderDirect Drive

Copper-fill PLA at a Glance

Strengths

  • Contains real copper particles — feels metallic
  • Can be polished to a real copper sheen
  • Develops natural patina over time
  • Much heavier than standard PLA

Weaknesses

  • Hardened nozzle recommended (metal particles)
  • Must print slowly to avoid clogs
  • Expensive (~$40-60/kg)
  • Brittle compared to standard PLA

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Sources: Based on manufacturer specifications and community recommendations, community testing data, manufacturer recommended ranges. Values calculated from filament specifications and printer hardware limits.